Description

Aluminum Nitride CAS NO 24304-00-5 is an advanced ceramic material prized for its exceptional thermal conductivity and excellent electrical insulation properties. This combination makes it a critical component in high-performance electronic and thermal management systems where efficient heat dissipation is paramount. It is essential for manufacturers in the semiconductor, power electronics, and LED packaging industries seeking to enhance device reliability and longevity.

Application

• Electronic Substrates & Packages: Used as a high thermal conductivity substrate for power modules, RF/microwave packages, and insulated gate bipolar transistors (IGBTs).
• Thermal Interface Materials (TIMs): Serves as a key filler in thermal greases, pads, and adhesives to improve heat transfer from chips to heat sinks.
• LED Heat Sinks: Employed in high-brightness and UV LED assemblies for superior thermal management, preventing lumen depreciation.
• Structural Ceramics: A component in composite ceramics requiring high thermal shock resistance and mechanical strength at elevated temperatures.
• Refractory Materials: Used in crucibles, molds, and linings for molten metal handling due to its stability and non-wettability.
• Fillers for Polymers: Incorporated into epoxy molding compounds and thermally conductive plastics to enhance their heat dissipation capability.

Basic Information

Product Name	Aluminum Nitride
CAS No.	24304-00-5
Molecular Formula	AlN
Molecular Weight	40.99 g/mol
Synonyms	Aluminium nitride; AlN; Aluminum mononitride; Nitridodialuminum; Thermic; Elnit; Elnitride; Shinano Kaken Kogyo AIN
EINECS	246-140-8

Quality Control

Our Aluminum Nitride is manufactured under stringent process controls to ensure batch-to-batch consistency and high performance. Quality is verified through a comprehensive suite of analytical tests, including particle size distribution (PSD), X-ray diffraction (XRD) for phase purity, and chemical analysis for key metallic impurities. A Certificate of Analysis (COA) detailing all specifications is provided with every shipment.

Storage

Preserve in a tightly closed container, protected from light. Due to its hygroscopic nature, this material must be stored in a cool, dry place with minimal exposure to atmospheric humidity. For long-term storage, consider using a desiccated environment or inert gas purging to prevent surface hydrolysis.

Specification

Item	Specification
Appearance	White to off-white powder
Identification (XRD)	Conforms to AlN standard pattern
Assay (AlN Content)	≥ 98.0 %
Oxygen Content	≤ 1.5 %
Carbon Content	≤ 0.1 %
Metallic Impurities (Fe, Ca, Si)	≤ 500 ppm (each)
Particle Size (D50)	1.0 - 5.0 µm (other grades available)
Specific Surface Area (BET)	3.0 - 8.0 m²/g
Thermal Conductivity	170 - 200 W/(m·K)

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.