Description

4,4'-Bis(2,3-Epoxypropoxy)Biphenyl is a high-purity, bifunctional epoxy resin monomer characterized by its rigid biphenyl core. This compound is a critical building block for advanced thermosetting polymers, offering enhanced thermal stability, chemical resistance, and mechanical properties to the final cured material. It is essential for manufacturers in the electronics, aerospace, and high-performance composite industries seeking to formulate next-generation epoxy systems.

Application

• Advanced Composite Matrices: As a cross-linking agent in epoxy resins for carbon fiber and fiberglass composites used in aerospace and automotive structural components.
• Electronic Encapsulation & Underfilling: Formulation of high-purity, low-stress epoxy compounds for semiconductor packaging, chip encapsulation, and printed circuit board (PCB) laminates.
• High-Temperature Adhesives: A key monomer in the synthesis of specialty adhesives and potting compounds requiring sustained performance at elevated temperatures.
• Specialty Coatings: Used in industrial and protective coatings where exceptional chemical resistance and durability are paramount.
• Polymer Modification: Serves as a reactive intermediate to introduce epoxy functionality and rigidity into other polymer backbones, enhancing their properties.

Basic Information

Product Name	4,4'-Bis(2,3-Epoxypropoxy)Biphenyl
CAS No.	2461-46-3
Molecular Formula	C20H22O4
Molecular Weight	326.39 g/mol
Synonyms	1,1'-Biphenyl, 4,4'-bis(2,3-epoxypropoxy)-; 4,4'-Diglycidyloxybiphenyl; Bisphenol A Diglycidyl Ether (Biphenyl Analog); Biphenyl Diglycidyl Ether; DGEBP; 4,4'-Bis(glycidyloxy)biphenyl; Biphenol Diglycidyl Ether; 4,4'-Bis(oxiran-2-ylmethoxy)-1,1'-biphenyl
EINECS	219-542-6

Quality Control

Our production of 4,4'-Bis(2,3-Epoxypropoxy)Biphenyl adheres to a stringent quality management system. Every batch undergoes comprehensive analytical testing, including HPLC for purity and epoxy equivalent weight (EEW) determination, to ensure it meets precise customer specifications. A detailed Certificate of Analysis (COA) documenting identity, purity, and key physical parameters is provided with each shipment.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). This product is hygroscopic (moisture-sensitive); containers must be kept tightly sealed to prevent absorption of atmospheric moisture, which can affect reactivity and performance.

Specification

Item	Specification
Appearance	White to off-white crystalline powder
Identification (IR)	Conforms to structure
Assay (HPLC)	≥ 98.0%
Epoxy Equivalent Weight (EEW)	163 - 167 g/eq
Melting Point	105 - 115 °C
Color (APHA)	≤ 100
Moisture (KF)	≤ 0.5%

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.