Description

Silver-Copper is a high-performance inorganic compound, typically an alloy or intermetallic phase, valued for its unique combination of electrical conductivity, thermal properties, and antimicrobial efficacy. This material is engineered to provide superior performance where standard metals or alloys fall short, offering enhanced durability and functional characteristics. It is essential for manufacturers and R&D teams in the electronics, metallurgy, and advanced materials sectors seeking reliable, high-purity components for specialized applications.

Application

• Electrical Contacts and Switches: Utilized for its excellent conductivity and resistance to arc erosion in high-performance relays, circuit breakers, and automotive components.
• Brazing and Soldering Alloys: Serves as a key constituent in filler metals for joining materials, particularly where high-strength, corrosion-resistant joints are required.
• Antimicrobial Coatings and Materials: Incorporated into surface treatments and composite materials to impart long-lasting antimicrobial properties for medical devices and public touchpoints.
• Catalyst and Catalyst Support: Acts as a catalyst or catalyst support in specialized chemical synthesis and pollution control processes.
• Thermal Interface Materials: Used in thermal pastes and pads for electronics to improve heat dissipation from high-power components.
• Decorative and Functional Plating: Applied as a coating to provide a tarnish-resistant, conductive, and aesthetically pleasing finish on various substrates.
• Aerospace and Defense Components: Employed in specialized bearings, coatings, and electrical systems where reliability under extreme conditions is critical.
• Research & Development: Serves as a precursor or model material in metallurgical studies and the development of new alloys and intermetallic compounds.

Basic Information

Product Name	Silver-Copper
CAS No.	11144-43-7
Molecular Formula	Contact for details
Molecular Weight	Contact for details
Synonyms	Silver copper alloy; Copper silver alloy; Ag-Cu; Silver-Copper compound; Copper-Silver intermetallic; Silver copper metal; Argentum cuprum; Silver doped copper
EINECS	Contact for details

Quality Control

Our Silver-Copper materials are produced and tested under a stringent quality management system to ensure batch-to-batch consistency and compliance with customer specifications. We provide comprehensive Certificates of Analysis (COA) detailing key parameters such as metallic purity, particle size distribution (where applicable), and compositional analysis. Our quality commitment supports applications requiring traceability and reliability, from industrial manufacturing to advanced research.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, well-ventilated area at room temperature (15-25°C). Keep away from incompatible materials such as strong acids and strong oxidizing agents. For long-term storage of fine powders, consider an inert atmosphere to minimize surface oxidation.

Specification

Item	Specification
Appearance	Metallic solid (powder, wire, ingot, or as specified)
Assay (Silver Content)	≥ 99.9% (or as per grade)
Assay (Copper Content)	Balance (or as per grade)
Particle Size (for powder grades)	Customizable (e.g., -100 mesh, -325 mesh)
Trace Metals (ICP-OES)	As per customer requirement
Density	~10.0 g/cm³ (typical, varies with composition)
Melting Point	Varies with composition (e.g., 780-960°C)

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.