Description

4,4'-Bis(2,3-Epoxypropoxy)-3,3',5,5'-Tetramethylbiphenyl is a high-purity, multi-functional epoxy resin monomer. This compound is valued for its ability to impart enhanced thermal stability, chemical resistance, and low dielectric properties to advanced polymer matrices. It is primarily sought by manufacturers in the electronics, aerospace, and high-performance composite industries for formulating next-generation adhesives, encapsulants, and matrix resins.

Application

• Advanced Electronic Encapsulation: Used as a key monomer in epoxy formulations for semiconductor packaging and chip encapsulation, offering superior moisture barrier properties and low thermal expansion.
• High-Temperature Composite Matrices: Serves as a critical building block for epoxy resins in carbon fiber and fiberglass composites for aerospace and automotive applications, providing excellent heat resistance.
• Specialty Adhesives & Coatings: Incorporated into structural adhesives and protective coatings where long-term durability under harsh chemical and thermal environments is required.
• Electrical Laminates: A component in the production of printed circuit board (PCB) laminates, contributing to low dielectric constant and dissipation factor for high-frequency performance.
• Optical and Photonic Polymers: Utilized in the synthesis of polymers for optical lenses and waveguide materials due to its rigid biphenyl structure and clarity.
• Research & Development: Employed as a specialized cross-linking agent or intermediate in the development of novel polymeric materials with tailored properties.

Basic Information

Item	Details
Product Name	4,4'-Bis(2,3-Epoxypropoxy)-3,3',5,5'-Tetramethylbiphenyl
CAS No.	85954-11-6
Molecular Formula	C24H30O4
Molecular Weight	382.50 g/mol
Synonyms	1,1'-Biphenyl, 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl-; Tetramethylbiphenyl diglycidyl ether; 3,3',5,5'-Tetramethyl-4,4'-biphenyl diglycidyl ether; Biphenol A diglycidyl ether derivative; TMBP-DGE; Tetramethyl biphenyl epoxy resin; 4,4'-Diglycidyloxy-3,3',5,5'-tetramethylbiphenyl
EINECS	Contact for details

Quality Control

Every batch of our 4,4'-Bis(2,3-Epoxypropoxy)-3,3',5,5'-Tetramethylbiphenyl is manufactured under a strict quality management system. We perform comprehensive analytical testing, including HPLC for purity and epoxide equivalent weight (EEW) determination, to ensure the product meets precise specifications for advanced applications. A Certificate of Analysis (COA) detailing all test results is provided with each shipment to guarantee traceability and consistency.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at a controlled room temperature (15-25°C). This product is hygroscopic (moisture-sensitive); containers must be kept tightly sealed to prevent absorption of atmospheric moisture, which can affect product performance.

Specification

Item	Specification
Appearance	White to off-white crystalline powder or solid
Identification (IR)	Conforms to structure
Assay (HPLC)	≥ 98.0%
Epoxide Equivalent Weight (EEW)	190 - 200 g/eq
Melting Point	85 - 95 °C
Color (APHA)	≤ 100
Moisture (KF)	≤ 0.5%

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.