Description

Liquid Rare Earth Polishing Compound is a high-performance, cerium oxide-based slurry formulated for precision surface finishing. This advanced material is engineered to deliver exceptional material removal rates and superior final surface quality, making it a critical consumable in high-tech manufacturing. It is essential for industries requiring ultra-smooth, defect-free surfaces on optical components, semiconductor wafers, and display glass.

Application

• Precision Optical Polishing: For finishing lenses, prisms, and mirrors to achieve nanometer-level surface roughness and high laser damage thresholds.
• Semiconductor Wafer CMP (Chemical Mechanical Planarization): Used in the planarization of silicon, silicon dioxide (SiO2), and shallow trench isolation (STI) layers for integrated circuit fabrication.
• Display Glass Finishing: Critical for polishing the cover glass for LCDs, OLEDs, and touch panels to ensure perfect clarity and flatness.
• Advanced Ceramic Polishing: Effective for finishing technical ceramics, sapphire substrates, and other hard, brittle materials used in electronics and engineering.
• Memory Disk Substrate Polishing: Used in the manufacturing of hard disk drive platters to achieve the ultra-smooth surfaces required for high-density data storage.
• Precision Metal Polishing: For final finishing of metal components in aerospace, medical devices, and precision instruments where surface integrity is paramount.

Basic Information

Product Name	Liquid Rare Earth Polishing Compound
CAS No.	68909-13-7
Molecular Formula	CeO2 (primary component)
Molecular Weight	172.12 g/mol (for CeO2)
Synonyms	Cerium Oxide Polishing Slurry; Ceria Slurry; Rare Earth Oxide Polishing Compound; CeO2 Slurry; CMP Slurry (Ceria-based); Optical Polishing Compound; Cerium(IV) Oxide Suspension; High-Purity Ceria Polish
EINECS	Contact for details

Quality Control

Our Liquid Rare Earth Polishing Compound is manufactured under a strict quality management system. Each batch is tested for critical parameters including particle size distribution (PSD), pH, solids content, viscosity, and metallic impurity levels to ensure consistent polishing performance and lot-to-lot reproducibility. Certificates of Analysis (COA) detailing these specifications are provided with every shipment.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). Avoid freezing and prolonged exposure to high temperatures. The container should be kept tightly sealed when not in use to prevent evaporation or contamination. Keep away from incompatible materials.

Specification

Item	Specification
Appearance	White to off-white homogeneous suspension
Primary Active Component	Cerium Oxide (CeO2)
Solids Content	Contact for details
Particle Size (D50)	Customizable (e.g., 0.5 µm, 1.0 µm, 2.0 µm)
pH Value	Typically 4.0 - 7.0 (adjustable)
Density	~1.1 - 1.3 g/cm³
Viscosity	Contact for details
Metallic Impurities (ICP-MS)	< 10 ppm total (customizable)

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.