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Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane And Phenyloxirane, Reaction Products With 4,4-Methylenebisbenzenamine CAS NO 68610-55-9
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CAS No.:68610-55-9
Grade:Pharmacy Grade
Content:99.9%
Brand:Customizable
Packaging:Customizable
Description
Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane And Phenyloxirane, Reaction Products With 4,4-Methylenebisbenzenamine is a high-performance, amine-functional epoxy resin adduct designed for advanced industrial applications. This specialized chemical offers enhanced thermal stability and mechanical properties, making it a critical component in formulating durable, high-performance materials. It is primarily sought by manufacturers in the coatings, adhesives, and advanced composite industries for demanding environments.
Application
- High-Performance Coatings: Used as a curing agent or modifier in epoxy-based industrial, marine, and protective coatings for superior chemical resistance and adhesion.
- Structural Adhesives & Sealants: A key component in formulating high-strength, heat-resistant adhesives for aerospace, automotive, and construction applications.
- Advanced Composite Materials: Serves as a matrix resin or hardener in fiber-reinforced plastics (FRP) and carbon fiber composites for lightweight, strong components.
- Electrical Encapsulation & Potting: Employed in potting compounds and encapsulants for electronic components requiring excellent insulation and environmental protection.
- Tooling & Molding Compounds: Used in the production of master models, molds, and high-temperature tooling due to its dimensional stability and durability.
- Civil Engineering & Flooring: Incorporated into high-strength epoxy grouts, self-leveling floors, and repair mortars for industrial and infrastructure projects.
Basic Information
| Product Name | Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane And Phenyloxirane, Reaction Products With 4,4-Methylenebisbenzenamine |
| CAS No. | 68610-55-9 |
| Molecular Formula | Complex Polymer Mixture |
| Molecular Weight | Contact for details |
| Synonyms | Epoxy Resin Adduct with DDS; Bisphenol A Epoxy Resin, reaction products with Dicyandiamide and 4,4'-Diaminodiphenyl sulfone; Epoxy hardener based on DDS; 4,4'-Diaminodiphenyl sulfone epoxy adduct; Amine-functional epoxy adduct; DDS-modified epoxy resin; Epoxy curing agent 68610-55-9; Thermosetting epoxy resin hardener. |
| EINECS | Contact for details |
Quality Control
Our production of this advanced epoxy adduct follows rigorous quality protocols to ensure batch-to-batch consistency and performance reliability. Key parameters such as amine value, epoxy equivalent weight, viscosity, and color are strictly monitored. A comprehensive Certificate of Analysis (COA) detailing all specifications is provided with each shipment to support your quality assurance and regulatory compliance needs.
Storage
Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). This product is hygroscopic (moisture-sensitive); ensure containers are sealed immediately after use to prevent absorption of atmospheric moisture. Keep away from strong alkalis and incompatible organic solvents.
Specification
| Item | Specification |
|---|---|
| Appearance | Viscous liquid to semi-solid |
| Color (Gardner) | ≤ 6 |
| Viscosity @ 25°C | Contact for details |
| Amine Value | Contact for details |
| Epoxy Equivalent Weight (EEW) | Contact for details |
| Non-Volatile Content | ≥ 99% |
| Moisture Content (Karl Fischer) | ≤ 0.5% |
Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.
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