Description

Diphenyl(4-Phenylthio)Phenylsulfonium Hexafluorophosphate is a high-purity photoacid generator (PAG) salt, a critical component in advanced photoresist formulations for high-resolution lithography. Its primary value lies in generating strong acids upon exposure to UV light, which catalyzes the chemical changes needed to create precise micro-patterns on semiconductor wafers. This compound is essential for manufacturers in the electronics and semiconductor industries who require exceptional purity and performance consistency for next-generation chip fabrication.

Application

• Semiconductor Photolithography: A key photoacid generator (PAG) in chemically amplified resists (CARs) for deep-UV (DUV), KrF, and ArF excimer laser lithography processes.
• Advanced Packaging: Used in the production of flip-chip packages, wafer-level packaging (WLP), and through-silicon vias (TSVs).
• Microelectromechanical Systems (MEMS): Enables the patterning of high-aspect-ratio structures for sensors and actuators.
• Printed Circuit Board (PCB) Fabrication: Employed in photoresists for creating fine-line circuitry on high-density interconnect (HDI) boards.
• Optical Component Manufacturing: Facilitates the patterning of diffraction gratings, waveguides, and other micro-optical elements.
• Research & Development: Serves as a benchmark compound in academic and industrial R&D for developing new photoresist chemistries and lithographic techniques.

Basic Information

Product Name	Diphenyl(4-Phenylthio)Phenylsulfonium Hexafluorophosphate
CAS No.	68156-13-8
Molecular Formula	C24H19F6PS2
Molecular Weight	516.49 g/mol
Synonyms	Diphenyl(4-phenylthiophenyl)sulfonium hexafluorophosphate; (4-Phenylthio)phenyldiphenylsulfonium hexafluorophosphate; Sulfonium, diphenyl[4-(phenylthio)phenyl]-, hexafluorophosphate(1-); Triphenylsulfonium hexafluorophosphate derivative; Photoacid Generator PAG; Sulfonium salt PAG; Lithography PAG; CAS 68156-13-8
EINECS	Contact for details

Quality Control

Our Diphenyl(4-Phenylthio)Phenylsulfonium Hexafluorophosphate is manufactured under strict quality management systems to ensure batch-to-batch consistency critical for semiconductor fabrication. Every lot undergoes rigorous analytical testing, including HPLC for purity and ICP-MS for trace metal content, to meet the exacting standards of the electronics industry. Certificates of Analysis (COA) detailing all specifications are provided with each shipment.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry place at a controlled room temperature (15-25°C). This material is hygroscopic (moisture-sensitive) and must be kept under dry, inert conditions to prevent decomposition. The storage area should be well-ventilated and separate from incompatible materials.

Specification

Item	Specification
Appearance	White to off-white crystalline powder
Identification (IR)	Conforms to structure
Assay (HPLC)	≥ 99.0%
Water Content (KF)	≤ 0.5%
Residue on Ignition	≤ 0.1%
Heavy Metals (as Pb)	≤ 10 ppm
Specific Impurities (HPLC)	Individual ≤ 0.1%, Total ≤ 0.5%

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.