Description

Temp-Bond CAS NO 60318-48-1 is a specialized chemical compound known for its unique bonding properties under specific thermal conditions. This product is critical for applications requiring precise, temporary adhesion that can withstand processing environments before clean release. It is primarily utilized by manufacturers in the electronics, optics, and precision engineering sectors where controlled material bonding and debonding are essential process steps.

Application

• Temporary Wafer Bonding: Used in semiconductor manufacturing to temporarily bond device wafers to carrier wafers during thinning and backside processing.
• Optical Component Assembly: Facilitates the precise alignment and holding of lenses and other optical elements during assembly and polishing.
• Microelectromechanical Systems (MEMS) Fabrication: Provides a temporary, stable bond for delicate MEMS structures during etching and deposition steps.
• Glass and Ceramic Processing: Acts as a handling adhesive for brittle substrates during cutting, grinding, and chemical strengthening processes.
• 3D Packaging and Through-Silicon Via (TSV) Technology: Enables the temporary bonding of stacked dies or wafers for 3D integration.
• Precision Machining: Secures small or complex parts to fixtures for machining operations, allowing for easy post-process removal.

Basic Information

Product Name	Temp-Bond CAS NO 60318-48-1
CAS No.	60318-48-1
Molecular Formula	Contact for details
Molecular Weight	Contact for details
Synonyms	TempBond, Temporary Bonding Adhesive 60318-48-1, Wafer Bonding Adhesive, Thermal Release Adhesive, Temporary Adhesive for Semiconductor Processing, Debonding Adhesive, Carrier Wafer Adhesive, Thermoplastic Temporary Bonding Material
EINECS	Contact for details

Quality Control

Our Temp-Bond CAS NO 60318-48-1 is manufactured under strict quality management systems to ensure batch-to-batch consistency and performance reliability for critical industrial processes. We provide comprehensive quality documentation, including Certificates of Analysis (COA) that detail purity, viscosity, thermal properties, and other key performance indicators. Our quality protocols are designed to meet the stringent requirements of the semiconductor and high-tech manufacturing industries.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). This material is hygroscopic (moisture-sensitive); ensure containers are sealed immediately after use to prevent degradation from atmospheric moisture.

Specification

Item	Specification
Appearance	Clear to pale yellow viscous liquid
Identification (IR)	Conforms to standard
Assay (HPLC)	≥ 98.0%
Viscosity @ 25°C	Specification available upon request
Thermal Release Temperature	Specification available upon request
Moisture Content (KF)	≤ 0.5%
Particulate Matter	Specification available upon request

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.