Description

Polyimide Resin CAS NO 39355-34-5 is a high-performance polymer known for its exceptional thermal stability, mechanical strength, and excellent chemical resistance. This material is critical for applications demanding reliability under extreme environmental and operational stress. It is primarily utilized by industries such as aerospace, electronics, and automotive for advanced components and insulation systems.

Application

• High-Temperature Insulation: Wire and cable enamels, slot liners, and insulating films for electric motors and generators.
• Aerospace Components: Critical parts for jet engines, structural composites, and thermal protection systems.
• Flexible Printed Circuit Boards (FPCs): Base substrate material for high-density, heat-resistant electronic circuits.
• Semiconductor Manufacturing: Used in photoresists, stress buffer coatings, and α-particle barrier layers for advanced chip packaging.
• Adhesives and Sealants: High-performance bonding agents for applications requiring long-term stability at elevated temperatures.
• Industrial Filtration: Membranes and filter media for hot, corrosive gas and liquid streams.

Basic Information

Product Name	Polyimide Resin
CAS No.	39355-34-5
Molecular Formula	(C22H10N2O5)n
Molecular Weight	~382.33 (monomer unit)
Synonyms	Polyimide; Polyimide Varnish; Kapton-type Polyimide; PI Resin; Poly(4,4'-oxydiphenylene-pyromellitimide); Pyromellitic Dianhydride/4,4'-Oxydianiline Copolymer; PMDA-ODA Polyimide; Vespel Resin (trade name type)
EINECS	Contact for details

Quality Control

Our Polyimide Resin is manufactured under stringent quality management systems. Each batch undergoes rigorous analytical testing to ensure consistency in key parameters such as molecular weight distribution, imidization degree, and thermal properties. Certificates of Analysis (COA) detailing purity, viscosity, and other critical specifications are available upon request.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). This material is hygroscopic (moisture-sensitive); keep the container tightly sealed to prevent moisture absorption, which can affect processing properties.

Specification

Item	Specification
Appearance	Yellow to amber solid or solution
Identification (IR)	Complies
Solid Content	10-30% (solution) or >99% (solid)
Inherent Viscosity	0.5 - 1.5 dL/g (typical)
Glass Transition Temp (Tg)	>350 °C
Thermal Decomposition Temp	>500 °C
Moisture Content	< 1.0%

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.