Description

Poly(3,3',4,4'-Benzophenonetetracarboxylic Dianhydride-Co-4,4'-Oxydianiline/1,3-Phenylenediamine), Amic Acid is a high-performance poly(amic acid) intermediate, a critical precursor in the synthesis of advanced polyimide materials. This compound matters for its ability to impart exceptional thermal stability, mechanical strength, and chemical resistance to the final polyimide resin. It is essential for manufacturers in the electronics, aerospace, and advanced coatings industries who require reliable, high-purity raw materials for demanding applications.

Application

This poly(amic acid) is a versatile building block for high-performance polymers, primarily used in:

• Flexible Printed Circuit (FPC) Manufacturing: As a key component in the production of high-temperature, dimensionally stable polyimide films used as substrates.
• Semiconductor Packaging: For creating stress-buffer coatings and interlayer dielectrics in advanced chip packaging due to its excellent thermal and electrical properties.
• High-Temperature Adhesives & Coatings: Formulating adhesives and protective coatings for aerospace and automotive applications where thermal and chemical resistance are paramount.
• Advanced Composite Materials: Serving as a matrix resin or sizing agent for carbon fiber and other high-performance fiber composites.
• Lithographic Materials: Used in the development of photosensitive polyimides for microelectronics patterning.
• Membrane Technology: For manufacturing gas separation or filtration membranes that require robust chemical and thermal stability.

Basic Information

Product Name	Poly(3,3',4,4'-Benzophenonetetracarboxylic Dianhydride-Co-4,4'-Oxydianiline/1,3-Phenylenediamine), Amic Acid
CAS No.	31942-21-9
Molecular Formula	(C29H16N2O7)n • (C12H10N2O)m
Molecular Weight	Varies (Polymer)
Synonyms	BPDA/ODA/PDA Poly(amic acid); Polyimide Precursor (BPDA-ODA/PDA based); Benzophenonetetracarboxylic Dianhydride-Oxydianiline-Phenylenediamine Copolymer, Amic Acid Form; BTDA-ODA/m-PDA Poly(amic acid); Polyamic Acid from 3,3',4,4'-Benzophenonetetracarboxylic Dianhydride, 4,4'-Oxydianiline, and 1,3-Phenylenediamine; Photosensitive Polyimide Precursor (PSPI); High-Temp Poly(amic acid) Resin
EINECS	Contact for details

Quality Control

Our Poly(3,3',4,4'-Benzophenonetetracarboxylic Dianhydride-Co-4,4'-Oxydianiline/1,3-Phenylenediamine), Amic Acid is manufactured under strict process controls to ensure batch-to-batch consistency and high performance. Quality is verified through a suite of analytical techniques including Gel Permeation Chromatography (GPC) for molecular weight distribution, FT-IR for structural identification, and titration for solid content and acid value. A comprehensive Certificate of Analysis (COA) detailing viscosity, solids content, and impurity profiles is provided with every shipment to support your quality assurance protocols.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at temperatures between 2°C and 8°C to maximize shelf-life and prevent premature imidization or viscosity changes. The material is sensitive to moisture and strong acids/organic solvents; keep the container tightly sealed when not in use and away from incompatible materials.

Specification

Item	Specification
Appearance	Yellow to amber viscous solution
Solid Content	10 - 25 % (w/w)
Solvent	N-Methyl-2-pyrrolidone (NMP) or mixture
Viscosity (25°C)	1,000 - 20,000 cP
Identification (IR)	Conforms to structure
Acid Value	Contact for details
Weight-Average Molecular Weight (Mw)	By GPC
Metal Impurities	< 10 ppm (ICP-MS)

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.