Description

Poly(3,3',4,4'-Biphenyltetracarboxylic Dianhydride-Co-1,4-Phenylenediamine),Amic Acid is a high-performance poly(amic acid) precursor, a critical intermediate in the synthesis of advanced polyimide polymers. This compound matters for its ability to impart exceptional thermal stability, mechanical strength, and chemical resistance to the final polyimide material. It is essential for manufacturers in the electronics, aerospace, and advanced composites industries who require materials capable of withstanding extreme environments.

Application

• High-Temperature Polyimide Synthesis: Primary precursor for manufacturing polyimide films, coatings, and resins with superior thermal endurance.
• Flexible Printed Circuit Boards (FPCBs): Used in the production of coverlays and base films for flexible electronics due to its excellent dielectric properties and dimensional stability.
• Aerospace & Aviation Components: Integral in creating lightweight, heat-resistant composite parts and wire insulation for aircraft and spacecraft.
• Semiconductor Packaging: Employed in advanced encapsulation materials and stress buffer coatings to protect sensitive microchips.
• Industrial Adhesives and Sealants: Serves as a base for formulating adhesives that maintain integrity under high thermal and mechanical stress.
• Advanced Membrane Technology: Used in the development of gas separation and filtration membranes that require chemical and thermal resilience.

Basic Information

Product Name	Poly(3,3',4,4'-Biphenyltetracarboxylic Dianhydride-Co-1,4-Phenylenediamine),Amic Acid
CAS No.	29319-22-0
Molecular Formula	Contact for details
Molecular Weight	Contact for details
Synonyms	Poly(amic acid) from BPDA and PDA; BPDA/PDA Poly(amic acid); Poly[4,4'-oxydiphthalic anhydride-co-4,4'-oxydianiline], amic acid form (related structural); Polyimide Precursor (BPDA-PDA); 3,3',4,4'-Biphenyltetracarboxylic dianhydride-1,4-phenylenediamine copolymer; BPDA-pp'ODA Poly(amic Acid); PAA (BPDA/PDA)
EINECS	Contact for details

Quality Control

Our Poly(3,3',4,4'-Biphenyltetracarboxylic Dianhydride-Co-1,4-Phenylenediamine),Amic Acid is manufactured under strict quality management systems. Each batch undergoes rigorous analytical testing, including viscosity, solid content, and residual solvent analysis, to ensure consistent performance and batch-to-batch reproducibility critical for polyimide synthesis. Certificates of Analysis (COA) documenting key specifications are available upon request.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry place at temperatures recommended for the specific grade (typically between 0°C and 10°C for extended stability). This material is hygroscopic (moisture-sensitive); containers must be kept sealed to prevent moisture absorption, which can affect viscosity and molecular weight. For long-term storage, consider storage under an inert atmosphere.

Specification

Item	Specification
Appearance	Yellow to amber viscous solution or solid
Solid Content	10-20% (in suitable solvent, e.g., NMP)
Viscosity	Specification available upon request
Identification (IR)	Conforms to structure
Residual Solvent (GC)	< 1.0%
Acid Value	Contact for details
Molecular Weight (GPC)	Specification available upon request

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.