Description

5-Isobenzofurancarboxylic Acid, 1,3-Dihydro-1,3-Dioxo-, Polymer With 1,1-Methylenebis4-Isocyanatobenzene is a high-performance polyimide precursor polymer, also known as a polyamic acid. This advanced material is critical for its exceptional thermal stability and mechanical properties in its cured, imidized form. It is primarily sought after by manufacturers in the electronics, aerospace, and advanced coatings industries for creating durable, heat-resistant components and insulating layers.

Application

• Flexible Printed Circuit (FPC) Manufacturing: Serves as a base material for high-temperature polyimide films used in flexible electronics.
• Semiconductor Passivation Layers: Used to create protective, insulating coatings on semiconductor devices due to its excellent dielectric properties.
• High-Temperature Adhesives and Coatings: Formulated into adhesives and protective coatings for aerospace and automotive applications where thermal resistance is paramount.
• Wire and Cable Insulation: Applied as an insulating varnish for wires and cables operating in extreme temperature environments.
• Advanced Composite Materials: Acts as a matrix resin or sizing agent for carbon fiber and other high-performance composites.
• Membrane Technology: Utilized in the production of high-temperature, chemically resistant separation membranes.

Basic Information

Product Name	5-Isobenzofurancarboxylic Acid, 1,3-Dihydro-1,3-Dioxo-, Polymer With 1,1-Methylenebis4-Isocyanatobenzene
CAS No.	25053-57-0
Molecular Formula	(C15H6N2O5)n
Molecular Weight	294.22 (monomer unit)
Synonyms	Poly(amic acid) from PMDA and MDI; Poly(pyromellitic dianhydride-co-4,4'-methylenebis(phenyl isocyanate)); PMDA-MDI Poly(amic acid); Polyimide Precursor (PMDA/MDI); 1,3-Dihydro-1,3-dioxo-5-isobenzofurancarboxylic acid polymer with 1,1'-methylenebis[4-isocyanatobenzene]; Polyamic Acid of Pyromellitic Dianhydride and Methylene Diphenyl Diisocyanate; BTDA-MDI Poly(amic acid) (common mis-association)
EINECS	Contact for details

Quality Control

Our production of this polyimide precursor adheres to strict batch-to-batch consistency protocols. Quality is monitored through key parameters including solution viscosity, solid content, residual solvent levels, and acid number. Certificates of Analysis (COA) detailing these specifications are provided with each shipment to ensure material performance for your specific application, whether for electronics or advanced composites.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at temperatures recommended for the specific solvent formulation (typically between 2°C and 25°C). This material is moisture-sensitive (hygroscopic) and may degrade upon prolonged exposure to atmospheric humidity. Keep away from heat sources and open flames.

Specification

Item	Specification
Appearance	Amber to dark brown viscous solution
Solid Content	10-20% (in NMP or other aprotic solvent)
Viscosity (25°C)	1,000 - 15,000 cP
Acid Number	Contact for details
Identification (IR)	Conforms to structure
Residual Solvent (GC)	< 1.0%
Metal Impurities	< 10 ppm (each)

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.