Description

Phenyl-Methylsilsesquioxane-Phenylmethylsiloxane-Diphenylsiloxane Tetrapolymer is a high-performance, multi-component silicone copolymer engineered for demanding applications. This advanced material offers a unique combination of thermal stability, optical clarity, and mechanical reinforcement derived from its complex silsesquioxane and siloxane architecture. It is essential for formulators and manufacturers in the electronics, advanced optics, and high-temperature coating industries seeking to enhance material performance.

Application

• LED Encapsulation & Optoelectronics: Used as a high-refractive-index, thermally stable encapsulant and lens material for high-power LEDs and optical devices.
• Advanced Semiconductor Packaging: Serves as a stress-buffering underfill or protective coating material due to its low thermal expansion and excellent dielectric properties.
• High-Temperature Resistant Coatings: A key component in formulating protective coatings for aerospace, automotive, and industrial equipment requiring long-term thermal and oxidative stability.
• Optical Grade Adhesives & Sealants: Imparts durability and clarity in precision optical bonding applications for lenses, displays, and sensors.
• Reinforcement for Specialty Polymers: Acts as a nano-scale reinforcing filler in engineering plastics and composites to improve heat resistance and dimensional stability.
• Dielectric Films in Electronics: Utilized in the fabrication of interlayer dielectric (ILD) films in microelectronics for its low dielectric constant and planarization properties.

Basic Information

Item	Detail
Product Name	Phenyl-Methylsilsesquioxane-Phenylmethylsiloxane-Diphenylsiloxane Tetrapolymer
CAS No.	181186-36-7
Molecular Formula	Typically represented as a complex copolymer; specific formula varies with monomer ratio.
Molecular Weight	Variable (Typically in the range of 1,000 - 50,000 g/mol). Contact for details.
Synonyms	Phenyl Methyl Silsesquioxane Siloxane Copolymer; PMSSQ-PMS-DPS Copolymer; Poly(phenylmethylsilsesquioxane-co-diphenylsiloxane); Phenylmethyl T-Resin Copolymer; Silsesquioxane-Siloxane Hybrid Resin; Aromatic Silicone Hybrid Polymer; Phenyl Modified MQ Resin; Optical Silicone Resin
EINECS	Contact for details

Quality Control

Our production of Phenyl-Methylsilsesquioxane-Phenylmethylsiloxane-Diphenylsiloxane Tetrapolymer adheres to a strict quality management system. Each batch is characterized for critical parameters including molecular weight distribution, refractive index, thermal stability, and purity to ensure consistency and performance for your application. Certificates of Analysis (COA) documenting these specifications are available upon request.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). Keep away from strong acids and organic solvents. For long-term storage under optimal conditions, please contact our technical team for specific recommendations.

Specification

Item	Specification
Appearance	Colorless to pale yellow viscous liquid or solid
Refractive Index (n20D)	1.50 - 1.58
Viscosity (at 25°C)	Specification available upon request
Weight Average Molecular Weight (Mw)	As per customer grade requirement
Phenyl Content	Specification available upon request
Volatile Content	< 1.0%
Thermal Decomposition Temperature (Td)	> 400°C

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.