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Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane, 4,4-Methylenebisbenzenamine And (2-Methylphenoxy)Methyloxirane CAS NO 138009-66-2


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CAS No.:138009-66-2

Grade:Pharmacy Grade

Content:99.9%

Brand:Customizable

Packaging:Customizable

Description

Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane, 4,4-Methylenebisbenzenamine And (2-Methylphenoxy)Methyloxirane CAS NO 138009-66-2 is a specialized, high-performance epoxy resin system designed for demanding industrial applications. This advanced polymer formulation offers a unique balance of thermal stability, chemical resistance, and mechanical strength, making it a critical component for creating durable composite materials and protective coatings. It is essential for manufacturers in the aerospace, automotive, electronics, and high-performance adhesives sectors who require reliable, engineered materials for critical bonding and encapsulation tasks.

Application

  • Advanced Composite Matrices: Used as a primary resin in fiber-reinforced composites for aerospace components, automotive body panels, and sporting goods, providing excellent strength-to-weight ratios.
  • High-Performance Coatings & Linings: Formulated into industrial and marine protective coatings that offer superior resistance to chemicals, corrosion, and abrasion.
  • Electronic Encapsulation & Potting: Serves as a potting compound or encapsulant for electrical components, transformers, and circuit boards, ensuring excellent insulation and environmental protection.
  • Structural Adhesives: A key ingredient in high-strength, heat-resistant adhesives used in metal-to-metal and composite bonding applications.
  • Tooling & Molding: Employed in the production of master models, molds, and fixtures that require dimensional stability and durability under repeated use.
  • Civil Engineering & Construction: Used in grouts, mortars, and concrete modifiers to enhance chemical resistance and structural integrity in harsh environments.

Basic Information

Product Name Phenol, 4,4-(1-Methylethylidene)Bis-, Polymer With (Chloromethyl)Oxirane, 4,4-Methylenebisbenzenamine And (2-Methylphenoxy)Methyloxirane
CAS No. 138009-66-2
Molecular Formula Complex Polymer Mixture
Molecular Weight Contact for details
Synonyms Epoxy Novolac Resin; Tetraglycidyl Methylenedianiline Epoxy Resin (TGMDA) Modified; Epoxy Resin, Bisphenol A-Novolac, Epichlorohydrin, Methylenedianiline, Cresyl Glycidyl Ether Polymer; Advanced Epoxy Thermoset Polymer; TGDDM Epoxy Resin Modification; Multifunctional Epoxy Resin System; High-Temperature Epoxy Curing Agent Blend.
EINECS Contact for details

Quality Control

Our production of this advanced epoxy resin system adheres to strict quality management protocols, including in-process controls and final batch testing. Key parameters such as epoxy equivalent weight (EEW), viscosity, gel time, and thermal properties are rigorously monitored to ensure batch-to-batch consistency and performance reliability. Certificates of Analysis (COA) detailing specific test results are provided with every shipment. We support compliance with relevant industry standards for composite and electronic materials.

Storage

Preserve in a tightly closed, moisture-proof container, protected from light. Store in a cool, dry, well-ventilated area at temperatures between 15°C and 25°C (59°F and 77°F). This product is hygroscopic (moisture-sensitive). Prolonged exposure to air and humidity must be avoided to prevent premature curing or changes in viscosity. Keep away from heat sources and open flame.

Specification

Item Specification
Appearance Viscous liquid to solid (color may vary)
Epoxy Equivalent Weight (EEW) Contact for details
Viscosity @ 25°C Contact for details
Gel Time @ 150°C Contact for details
Volatile Content < 1.5%
Chloride Content < 500 ppm
Softening Point (if solid) Contact for details

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.

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