Description

Bisphenol 0Ppa CAS NO 126531-39-3 is a specialized phenolic compound used as a high-performance intermediate in advanced polymer synthesis. This chemical is valued for its role in creating materials with enhanced thermal stability and mechanical properties. It is primarily required by manufacturers in the polymer, specialty resin, and advanced material coating industries seeking to improve product performance.

Application

• Intermediate for the synthesis of high-performance polycarbonates and epoxy resins.
• Key monomer in the production of engineering plastics for automotive and electronic components.
• Used in formulating specialty coatings and adhesives requiring chemical resistance.
• Building block for flame-retardant polymers in construction and electrical applications.
• Research and development of novel thermosetting polymers.
• Production of composite materials for aerospace and industrial uses.

Basic Information

Product Name	Bisphenol 0Ppa
CAS No.	126531-39-3
Molecular Formula	C21H28O4
Molecular Weight	344.45 g/mol
Synonyms	4,4'-(1-Phenylethylidene)bisphenol; Phenol, 4,4'-(1-phenylethylidene)bis-; Bisphenol AP; 1,1-Bis(4-hydroxyphenyl)-1-phenylethane; Bisphenol P; BPAF analog; Bisphenol A Phenol; BPP
EINECS	Contact for details

Quality Control

Our Bisphenol 0Ppa is manufactured under a strict quality management system. Every batch undergoes comprehensive analytical testing, including HPLC and GC analysis, to ensure high purity and consistency. Certificates of Analysis (COA) documenting identity, purity, and impurity profiles are available upon request to support your quality assurance protocols.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at a controlled room temperature (15-25°C). This product is easily oxidized and should be handled under an inert atmosphere for long-term storage to maintain stability.

Specification

Item	Specification
Appearance	White to off-white crystalline powder
Identification (IR)	Conforms to structure
Assay (HPLC)	≥ 98.5%
Melting Point	168°C - 172°C
Loss on Drying	≤ 0.5%
Related Substances (HPLC)	Total impurities ≤ 1.5%

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.