Description

Copper Fluoborate Solution (45%) is a high-purity, concentrated aqueous solution of copper(II) fluoborate, a key inorganic salt essential for advanced electroplating and metal finishing processes. Its primary value lies in providing a stable, soluble source of copper ions in highly conductive fluoborate-based electrolytes, enabling uniform, high-speed deposition with excellent throwing power. This product is critically needed by manufacturers in the electronics, printed circuit board (PCB), and decorative plating industries for producing durable, conductive copper coatings. CAS NO 108882-05-9.

Application

• Electroplating & Electroforming: Primary electrolyte component for high-speed acid copper plating, especially in through-hole plating of PCBs and the production of intricate electroforms.
• Printed Circuit Board (PCB) Manufacturing: Used in the electrodeposition of copper for conductive traces, vias, and pads due to its excellent throwing power and deposit uniformity.
• Rotogravure & Roll Plating: Essential for plating printing rolls and cylinders in the packaging and publishing industries to create durable, wear-resistant copper surfaces.
• Decorative & Functional Finishing: Applied for decorative copper plating on automotive trim, hardware, and household fixtures, as well as for functional undercoats for subsequent nickel or chrome layers.
• Metal Recovery & Refining: Serves as a chemical source in certain hydrometallurgical processes for copper recovery and purification.
• Catalyst Preparation: Used as a precursor in the synthesis of copper-based catalysts for organic synthesis and chemical manufacturing.

Basic Information

Product Name	Copper Fluoborate Solution (45%)
CAS No.	108882-05-9
Molecular Formula	Cu(BF₄)₂ (in aqueous solution)
Molecular Weight	237.15 g/mol (anhydrous)
Synonyms	Copper(II) Fluoborate Solution; Cupric Fluoborate Solution; Copper Tetrafluoroborate Solution; Copper Borofluoride Solution; Copper Fluoroborate Solution; Cu(BF₄)₂ Solution; Acid Copper Fluoborate Electrolyte
EINECS	Contact for details

Quality Control

Our Copper Fluoborate Solution (45%) is manufactured under strict quality management protocols to ensure batch-to-batch consistency and performance in critical applications. Each lot undergoes rigorous analytical testing, including assay, impurity profile analysis (for iron, lead, and other heavy metals), and physical characterization. A Certificate of Analysis (COA) detailing all test results is provided with every shipment to guarantee compliance with agreed specifications and industry standards.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, well-ventilated area at room temperature (15-25°C/59-77°F). Keep the container tightly sealed when not in use to prevent evaporation and absorption of atmospheric moisture. This solution is incompatible with strong acids/organic solvents and fluoride/strong alkali materials; store separately from these substances.

Specification

Item	Specification
Appearance	Clear, blue-green solution
Assay (as Cu(BF₄)₂)	44.0 - 46.0 % w/w
Copper (Cu) Content	12.0 - 13.0 % w/w
Free Fluoboric Acid (as HBF₄)	1.0 - 3.0 % w/w
Density (at 20°C)	~1.50 g/mL
pH	< 1.0
Insoluble Matter	≤ 0.01 %
Chloride (Cl)	≤ 0.005 %
Sulfate (SO₄)	≤ 0.01 %
Iron (Fe)	≤ 0.005 %
Lead (Pb)	≤ 0.001 %

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.