Description

Bis[4-(4-Aminophenoxy)Phenyl]Sulfone is a high-purity aromatic diamine monomer featuring a sulfone linkage and ether bridges, offering excellent thermal stability and mechanical properties. This compound is a critical building block for the synthesis of advanced polyimides and other high-performance polymers. It is essential for manufacturers in the aerospace, electronics, and specialty plastics industries seeking to develop materials with superior heat resistance and durability.

Application

• High-Performance Polyimide Synthesis: Serves as a key diamine monomer for producing polyimide resins and films used in flexible printed circuits (FPCs) and high-temperature electrical insulation.
• Advanced Composite Materials: Used in the production of matrix resins for carbon fiber composites in aerospace and automotive applications requiring lightweight, high-strength components.
• Epoxy Curing Agent & Modifier: Acts as a curing agent or additive for epoxy resin systems to enhance their thermal stability, toughness, and chemical resistance.
• Polyamide-imide (PAI) Production: A precursor in the manufacture of PAI polymers, which are used for demanding applications like wire enamels and industrial coatings.
• Gas Separation Membranes: Employed in the synthesis of polymers for selective gas separation membranes due to its rigid molecular structure.
• Adhesive & Sealant Formulations: Incorporated into high-temperature adhesives and sealants for electronic packaging and structural bonding.

Basic Information

Product Name	Bis[4-(4-Aminophenoxy)Phenyl]Sulfone
CAS No.	13080-89-2
Molecular Formula	C24H20N2O4S
Molecular Weight	432.49 g/mol
Synonyms	4,4'-Bis(4-aminophenoxy)diphenyl sulfone; 1,1'-Sulfonylbis[4-(4-aminophenoxy)benzene]; BAPS; Bis(4-(4-aminophenoxy)phenyl) sulfone; 4,4'-Diaminodiphenylsulfone diether; BAPPS; 4,4'-(Sulfonylbis(4,1-phenylene))bis(oxy))dianiline
EINECS	Contact for details

Quality Control

Our Bis[4-(4-Aminophenoxy)Phenyl]Sulfone is manufactured under strict quality management systems. Each batch undergoes rigorous analytical testing, including HPLC for purity and identity confirmation, to ensure it meets precise specifications for polymer-grade applications. Certificates of Analysis (COA) documenting purity, melting point, and impurity profiles are available upon request.

Storage

Preserve in a tightly closed container, protected from light. Store in a cool, dry, and well-ventilated area at room temperature (15-25°C). This material is easily oxidized; for long-term storage, consider keeping under an inert atmosphere such as nitrogen. Keep away from strong oxidizing agents.

Specification

Item	Specification
Appearance	White to light yellow crystalline powder
Identification (IR)	Conforms to structure
Assay (HPLC)	≥ 98.5%
Melting Point	175 - 185 °C
Loss on Drying	≤ 0.5%
Heavy Metals (as Pb)	≤ 10 ppm

Note: Specifications can be tailored. Please contact us for the detailed technical data sheet of a specific grade.